• Custom 8 Slot backplane VME, VXS, VPX and cPCI

• Custom backplane supporting up to 200 I/O signals

• Chassis accepts IEEE 1101.2 conduction-cooled cards

• Customized Front Panel Input and Output Connectors

• +28 VDC Power input per MIL- STD-704D

• Output power 200 watts, +3.3, 5, 12 and -12 VDC

• Environmentally sealed for harsh mechanical, chemical and climatic conditions per MIL-STD-810

• Compact and Lightweight Aluminum construction brazed per MIL-B-7883

• Conduction cooled cold plate mounting. Precision machined mounting surface to ensure excellent heat transfer. Stainless steel captive fasteners on all removable panels.

• Sealed Faraday Cage and EMI/RFI filtering

• Operating -50 to 80°C, Storage -55 to 125°C

Overview

Macrolink’s ML750CC is a conduction cooled 8-slot VME, VXS, VPX and cPCI rugged enclosure, designed for avionics, ground vehicles and space applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure.

Mechanical Design

ML750CC is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6, brazed per MIL-B-7883, minimizes the need for fasteners and provides robust Faraday shielding protection for your electronic payload.  Removable panels use stainless steel captive hardware & self-locking helicoils for maximum shock and vibration security. A modular plug-in power supply supports low Mean Time To Repair service.

Thermally Efficient

Conduction cooling is through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat is conducted through this brazed inner structural member then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.

Macrolink’s in-house thermal analysis capabilities can dramatically shorten the delivery time of your completed system by eliminating the risk of project failure due to overheating. We can analyze a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), and radiation – then implement a solution based on your specific board requirements. You are assured early in the design process that your product’s thermal requirements have been satisfied.

We utilize the native solid-model CAD geometry to produce a selection of shaded display, particle trace animation and clipping planes to optimize thermal performance and validate our design.

Front Panel

The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each  customer’s unique requirements. Front panel options include:

• Elapse time indicator

• Ground stud - Inside front panel (.250-20 UNC)

• Status LED indicators

Corrosion Resistant Finish

The enclosure is chromate conversion coated per MIL-C-5541 Class 3 for maximum protection against corrosion on all surfaces, then the exterior is epoxy painted to standard military standards and colors. For space applications, Anodic Coating per MIL-A-8675 Type I is used. All materials and finishes are fungus resistant.

Board Capacity

The ML750+CC accommodates 8 standard VME64x boards, including a power supply, with 0.8" pitch:

• IEEE 1101.2 conduction cooled cards.

• Optional board spacing available upon request.

VME Backplane

Backplane is VME64X complaint, ANSI/VITA 1.1-1997, with 5 row 160-pinned J1, J2 connectors with P0 80 pin connectors in all slots.  Any of the pins in rows A and C, and user defined. Pins in rows Z and D of the J2 connectors as well as the 95 I/O pins on P0 connectors can be routed to the front I/O panel.

Optional cPCI per PICMG 2.0 standard also available.