• Custom 4 Slot backplane 3U cPCI

• Custom backplane supporting up to 200 I/O signals

• Chassis accepts IEEE 1101.2 conduction-cooled cards

• Customized Front Panel Input and Output Connectors

• +28 VDC Power input per MIL- STD-704D

• Output power 115 watts, +3.3, 5 VDC, +/-12 Optional

• Environmentally sealed for harsh mechanical, chemical and climatic conditions per MIL-STD-810E

• Compact and Lightweight Aluminum construction brazed per MIL-B-7883

• Liquid flow-through internally machined cooling path.

• Sealed Faraday Cage and EMI/RFI filtering

• Operating -40 to 80°C, Storage -55 to 125°C

Overview

Macrolink’s ML750CCM is a conduction cooled 4-slot cPCI rugged enclosure, designed for avionics, ground vehicles and space applications. The structure is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure.

Mechanical Design

ML750CCM is optimized to provide maximum strength with minimum weight. Lightweight aluminum 6061-T6, brazed per MIL-B-7883, minimizes the need for fasteners and provides robust Faraday shielding protection for your electronic payload.  Removable panels use stainless steel captive hardware & self-locking helicoils for maximum shock and vibration security. A modular plug-in power supply supports low Mean Time To Repair service.

Thermally Efficient

Liquid sidewall cooling is passed through precision-machined card guides in the sidewalls. Both circuit card assemblies and power supply heat is conducted through this brazed inner structural member then to the mounting interface. A 63 micro-inch surface finish reduces the thermal resistance path between mounting interfaces.

Macrolink’s in-house thermal analysis capabilities can dramatically shorten the delivery time of your completed system by eliminating the risk of project failure due to overheating. We can analyze a variety of heat transfer regimes – conduction, convection (natural, mixed, forced), conjugate (simultaneous conduction and convection), and radiation – then implement a solution based on your specific board requirements. You are assured early in the design process that your product’s thermal requirements have been satisfied.

We utilize the native solid-model CAD geometry to produce a selection of shaded display, particle trace animation and clipping planes to optimize thermal performance and validate our design.

Front Panel

The integral front panel accommodates MIL style M38999 connectors with high-density internal connectors and is customized, along with the backplane, to meet each  customer’s unique requirements.

Corrosion Resistant Finish

The enclosure is chromate conversion coated per MIL-C-5541 Class 3 for maximum protection against corrosion on all surfaces, then the exterior is epoxy painted to standard military standards and colors. For space applications, Anodic Coating per MIL-A-8675 Type I is used. All materials and finishes are fungus resistant.

Board Capacity

The ML750CCM accommodates 4 32-bit 3U cPCI boards, including a power supply, with 0.8" pitch:

• IEEE 1101.2 conduction cooled cards.

• Optional board spacing available upon request.

cPCI Backplane

Backplane is PICMG 2.0 cPCI complaint, with 5 row 220-pinned J1, J2 connectors in all slots.  Any of the J2 pins can be routed to the front I/O panel.

Optional 64-bit cPCI per PICMG 2.0 also available.